彭雨璇, 谢恩泽, 王美艳, 张 秀, 赵永存. 场地土壤污染信息三维空间插值研究进展及展望[J]. 土壤通报, 2021, 52(5): 1244 − 1250. DOI: 10.19336/j.cnki.trtb.2021031708
引用本文: 彭雨璇, 谢恩泽, 王美艳, 张 秀, 赵永存. 场地土壤污染信息三维空间插值研究进展及展望[J]. 土壤通报, 2021, 52(5): 1244 − 1250. DOI: 10.19336/j.cnki.trtb.2021031708
PENG Yu-xuan, XIE En-ze, WANG Mei-yan, ZHANG Xiu, ZHAO Yong-cun. Three-Dimensional Spatial Interpolation of Soil Pollutant at Contaminated Sites: Progress and Prospects[J]. Chinese Journal of Soil Science, 2021, 52(5): 1244 − 1250. DOI: 10.19336/j.cnki.trtb.2021031708
Citation: PENG Yu-xuan, XIE En-ze, WANG Mei-yan, ZHANG Xiu, ZHAO Yong-cun. Three-Dimensional Spatial Interpolation of Soil Pollutant at Contaminated Sites: Progress and Prospects[J]. Chinese Journal of Soil Science, 2021, 52(5): 1244 − 1250. DOI: 10.19336/j.cnki.trtb.2021031708

场地土壤污染信息三维空间插值研究进展及展望

Three-Dimensional Spatial Interpolation of Soil Pollutant at Contaminated Sites: Progress and Prospects

  • 摘要: 高分辨率、高精度的土壤污染物三维(3D)空间分布信息对于场地污染风险评估、场地修复及精准管控具有重要意义。本文首先介绍了场地污染物空间分布的特点及主要影响因素,系统总结了场地常用的3D空间插值方法及其主要进展,并基于空间变异性表达、辅助信息整合和不确定性评估三个方面分析了现有场地污染3D插值方法存在的问题,最后,针对钻孔布设方案设计、辅助信息获取、空间插值模型开发和插值技术流程的规范化提出了研究建议和展望。

     

    Abstract: High resolution three-dimensional (3D) spatial information of soil pollutants at contaminated site is extremely important for pollution risk assessment, remediation, and precise management and control of the site. This paper first introduced the main characteristics and affecting factors of pollutant variability and spatial distribution at contaminated site, and then systematically reviewed the commonly used 3D spatial interpolation method of site pollutant in existing studies and engineering applications. The shortcomings of the existing 3D interpolation method, and the research gaps between 3D spatial interpolation method and auxiliary information incorporation, as well as the uncertainty assessment were also identified. Finally, the research suggestions were proposed from the aspects of soil borehole sampling scheme design, auxiliary information acquisition, spatial interpolation model development, and technological specification of 3D interpolation application.

     

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